[Chip News] ADI's revenue increased by 25% year-on-year, and TI's new wafer factory has been put into operation.

[Chip News] ADI's revenue increased by 25% year-on-year, and TI's new wafer factory has been put into operation.

1. ADI's revenue and profit growth in the third fiscal quarter were strong, and orders continued to grow

     ADI recently announced its financial report for the third fiscal quarter of 2025 (ending August 2), with revenue of $2.88 billion, a year-on-year increase of 25%, and double-digit growth in all end markets; gross profit margin was 62.1%, a year-on-year increase of 5.4 percentage points; operating profit was US$818 million, a year-on-year increase of 67%; operating profit margin was 28.4%, a year-on-year increase of 7.2 percentage points.

     Vincent Roche, CEO and chairman of ADI, said that despite geopolitical challenges, ADI's revenue and earnings per share in the third quarter exceeded expectations. While tariffs and trade fluctuations have created market uncertainty, demand for ADI products remains strong.

     Chief Financial Officer Richard Puccio said ADI's backlog continued to grow at the end of the third quarter, with a healthy booking trend, especially in the industrial end market. The favorable Q3 results and the prospect of continued growth in the fourth quarter positioned ADI to finish fiscal 2025 strongly.

2. Texas Instruments' new wafer factory was opened, and Apple was the first customer

     According to IT House News, CNBC reported that Texas Instruments' $60 billion 300mm wafer fab in Sherman, Texas was officially opened. The facility is the first phase of Texas Instruments' four new fabs in Sherman and is part of a total of seven new expansions in Texas and Utah that will operate on 100 percent renewable energy.

     Apple confirmed that it will be the first customer of the factory to produce 'key basic semiconductors' for devices such as iPhones. This type of chip is not an A/M series processor, but an analog and embedded chip with a unit price of about $0.4, which is responsible for basic functions such as power management and sensor signal processing. Although this batch of 45-130nm process chips is not a cutting-edge product, it is also an indispensable and important component of 3C electronics.

3.SK Hynix announced mass production of 321-layer 2Tb QLC flash memory

     SK hynix recently announced that it has developed a 321-layer 2Tb QLC1 NAND flash memory product and started mass production. SK hynix said that the company was the first in the world to complete the development of QLC NAND flash memory with more than 300 layers, once again breaking through the technical limit. The product has the highest degree of integration among existing NAND flash memory products, and after verification by global customer companies, it is planned to officially enter the AI data center market in the first half of next year.

     SK hynix plans to first apply 321-layer NAND flash memory on computer solid-state drives (PC SSDs), and then gradually expand to enterprise solid-state drives (eSSDs) for data centers and embedded storage (UFS) products for smartphones. In addition, the company will also achieve double the integration degree based on the unique Package3 technology that stacks 32 NAND chips, and officially enter the ultra-high-capacity eSSD market for AI servers.

4. OmniVision Group released the second SBC solution, which is aimed at body control applications

     OmniVision Group recently announced that it will soon launch a new high-performance body control application SBC solution OKX0330. This product is the second product in the SBC series, integrating modules such as LDO, CAN/LIN transceiver, Watchdog, and high-side switches, and is mainly used in body control fields such as seat control, doors and windows, thermal management, and lights, fully meeting the various application needs of customers.

     OKX0330 powerful functions, fully benchmarking a German brand mid-range SBC series products, customers can achieve barrier-free switching. On top of this, the product also optimizes EMC performance – adding CAN SIC function, saving external common-mode inductors, reducing peripheral circuit design costs, and supporting functional safety ASIL-B system design. OKX0330 series now supports sample feeding.

5. Jiejie Microelectronics: The company has mass-produced more than 100 automotive-grade MOSFETs

     According to the Financial Associated Press, Jiejie Microelectronics released an announcement on the investor relations activity record sheet, saying that the field of automotive electronics is one of the downstream application fields that the company will focus on developing in the future, and there are currently nearly 200 automotive-grade MOSFET products to choose from, and the products in this field are continuously being developed and updated.

     The company has mass-produced more than 100 automotive-grade MOSFETs, among which JMSHO40SAGQ with Jiejie Microelectronics' own intellectual property rights JSFET chips, all-copper frames and jumper packaging processes, the performance is outstanding, meets the strict standards of the automotive industry, and has been widely used in the steering, fuel, lubrication, cooling and other systems of domestic tier-1 auto parts suppliers. The main customers in the downstream of the automotive category include Roswell, Honeywell, Dongfeng Technology, Etek, Kosda, BYD, Sanhua, Huayu, Nidec, etc.

6. Tianyue Advanced and Toshiba Electronic Components reached a cooperation agreement on SiC substrates

     Tianyue Advanced, a major domestic monocrystalline SiC substrate manufacturer, announced that it has reached a basic agreement with Toshiba Electronic Components for the substrates for SiC power semiconductors developed and manufactured by Tianyue Advanced, and the two parties will carry out the following cooperation: technical cooperation to improve the characteristics and quality of SiC power semiconductors, and commercial cooperation to expand the supply of high-quality and stable substrates using the results of the cooperation.

     Based on its track record in the development, manufacturing, and supply of SiC power semiconductors for railways, Toshiba Electronic Components is accelerating the development of SiC devices for server power supplies and automotive applications, and will continue to further reduce SiC power semiconductor losses and develop highly reliable and high-efficiency products for efficient power conversion applications.

7. Rockchip: Some AI glasses customer projects use the company's products

     According to the Financial Associated Press, Rockchip executives said at the 2025 semi-annual results briefing that the company has a long-term accumulation in ISP, video, display, audio and other related technical routes, RV series vision chips rely on the advantages of low-power solutions and self-developed ISPs, and at the same time further optimize AI image stabilization, codec and other technologies for sports scenarios such as AI glasses, which can be applied to AI glasses, and there are currently customer projects using the company's products.

     In addition, as of the end of the second quarter of this year, the company's inventory was about 800 million yuan, including about 330 million yuan of inventory goods and about 470 million yuan of entrusted processing materials. Because the company's main products adopt advanced technology, high design complexity and long production cycle, it is necessary to prepare inventory in advance; Coupled with the current complex and volatile international situation, the company will consider proactive and continuous strategic stocking from the perspective of ensuring supply chain security.

8. Yageo once again raised the purchase price of Shibaura Electronics

     Yageo, a major manufacturer of passive components, officially launched a public tender offer for Shibaura Electronics on May 9, 2025. Shibaura Electronics is a world-renowned manufacturer of negative temperature coefficient (NTC) thermistors with strong technical strength.

     On August 23, Yageo announced that it would further increase the tender offer price from 6,635 yen per share to 7,130 yen per share. In accordance with relevant Japanese regulations, Yageo extended the public tender offer period to September 8, 2025.